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 A newsletter for the solid modeling community

Volume 4, No. 7, July 2003
Features


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“Beyond 3D; Part 3 “Fitting the square peg in the round hole?” 
by Robert A. Konczal, Chief Technical Officer

In order to realize the maximum ROI from your SolidWorks investment, there are many issues that software, hardware and networking will not solve.  Actually, it is most likely that you have found out that a new technology toolkit out of the box can disrupt daily operations with your current methodologies.  This once again goes back to the “Bananas Story” in part one of this article series.  To date we have discussed the main components necessary to leverage 3D data throughout the company and potentially the enterprise.  However, without a plan on deploying these tools can only lead to mediocre results.  For most companies, it’s like fitting a square peg in a round hole—IT JUST DON’T FIT!   This article will touch upon the mind set in order to implement effectively and realize the true potential of the investment.. For complete article, click here

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Using Radiate Surface for Mold Modeling
by Brad Snow, Technical Analyst

The Radiate Surface command is a useful tool for establishing the parting surface that will be used when you create mold components based on a Master part. Using Radiate Surface in conjunction with the Combine feature allows us to create a robust mold model within a single part file – removing the requirement to create a secondary assembly model and deal with the inherent headaches involved with multi-file parametric associativity.
For complete article, click here.

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From the President

Implementation or Just Installation?
by Richard Werneth, President

Selecting and implementing a new engineering technology such as an MCAD solution is a significant project. There are two schools of thought in this process: 1) We are buying a new piece of CAD software for engineering 2) We are investing in a technology that can positively (or negatively) impact every area of our organization.
For complete article, click here.

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