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CircuitWorks by SolidWorks

What's New for SolidWorks Premium Users
Integration of electrical and mechanical design software

CircuitWorks™ is now included in SolidWorks Premium, which bridges the gap between electronic CAD and mechanical CAD software.

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arrowCircuitWorks is a bi-directional IDF and PADS file interface for SolidWorks 3D CAD software.

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An IDF 3.0 format file open in the CircuitWorks for SolidWorks user  interface.
(click on image above for larger view)
CircuitWorks enables electrical and mechanical design engineers to collaborate by integrating their discipline’s needs to make sure PCBs fit and function in mechanical products.  CircuitWorks helps teams streamline their development process and improve quality.

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An IDF 4.0 format file open in CircuitWorks for SolidWorks showing the traces.
(click on image above for larger view)

Once a file is open in CircuitWorks, it can be modified using the advanced property editing and filtering tools. Small components, which might not be required in SolidWorks, can be filtered out for example. When the user is happy with the data, the circuit board and components can be built in SolidWorks as an assembly.

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A SolidWorks Assembly modelled by CircuitWorks for SolidWorks.
The CircuitWorks  'Locate Component' window is also shown.
(click on image above for larger view)

CircuitWorks can be used with existing SolidWorks component models, or can build its own simple component models using the data in the ECAD file. CircuitWorks stores the component models it creates in its component library for future re-use. CircuitWorks gets faster as it builds up a larger collection of component models.

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The CircuitWorks Component Library:
Component names from the ECAD file can be cross referenced against the SolidWorks model to used to represent it. The library supports Parts, Assemblies and Configurations.
(click on image above for larger view)

CircuitWorks is
bi-directional, meaning that SolidWorks parts and assemblies can be exported from SolidWorks into the CircuitWorks user interface and can then be modified and saved as IDF files to be read back into an ECAD system.

How can the CircuitWorks-generated models be used?

CircuitWorks uses the information in IDF or PADS ASCII files to produce a fully detailed 3D SolidWorks assembly of a PCB and its components. The completed SolidWorks assembly can be used in a number of ways:

  • Checking for Interference:  By transferring an accurate model of a PCB and its components accurately into SolidWorks, users can check for any potential clash between the circuit board and its surroundings. If there is a clash, the board shape or the positions of components on it can be altered and the resulting changes saved back out for use with the ECAD system.
  • Creating Complex Board Shapes:  Often the shape and size of a PCB is driven by the product that will contain the board. Using CircuitWorks, the board and any key components can be modeled initially in SolidWorks, and the shape captured and exported to an ECAD system.
  • Visualization:  CAD models are increasingly used for visualization and sales opportunities, often before the product has been manufactured. Using CircuitWorks for SolidWorks, images of accurate models of PCBs with their components can be generated for use in sales situations.
  • Prototyping: SolidWorks models created by CircuitWorks can be used to create physical prototypes in conjunction with rapid prototyping systems.
  • Manufacturing:  CircuitWorks embeds ECAD information into the SolidWorks assemblies it creates. This information can then be used to add annotations such as reference designators to assembly drawings which can then be used as aids to manufacturing the PCB assembly.
  • PDM:  CircuitWorks adds custom properties defined in the IDF file format into the SolidWorks component models it creates. These attributes can then be used to describe the component in a data management system such as PDMWorks.
  • Analysis:  The 3D PCB models generated from ECAD data can be used for thermal analysis, especially in the case of products with tight packaging constraints such as cellular phones and PDAs where localized heat buildup can cause problems.
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