Create a time- and money-saving electronic cooling strategy that ensures product thermal performance and quality using CAD-embedded SOLIDWORKS Flow Simulation and the Electronic Cooling Module. Thermal management studies optimize heat dissipation, address thermal management problems common to products with printed circuit boards (PCBs), and help in selecting electronic devices.
Electronic Cooling Analysis Overview
Dedicated SOLIDWORKS Flow Simulation tools, augmented with the Electronic Cooling Module, perform complete thermal analysis, quickly and easily testing changes during design before any physical prototypes are built.
The Electronic Cooling Module uses dedicated electronic thermal models created through SOLIDWORKS computational fluid dynamics (CFD) to predict airflow, temperature, and heat transfer in components, boards, and complete products.
- Airflow optimization—how to ensure that devices receive the sufficient natural or forced ventilation, delivered in the most effective way possible
- Heat sinks and heat pipes—how to select the right heat sink and heat pipe to achieve a successful product cooling strategy
- Fan selection—how to choose the best fan to meet the products airflow requirements