Molded Interconnected Devices (MIDs)

3D Printed Molded Interconnected Devices (MIDs) Applications

New Capabilities with 3D Printed MIDs

Molded Interconnect Devices (MIDs) integrate mechanical and electronic functions in a single component to optimize and miniaturize design, as well as improve function, performance, and reliability of connected products.

With the ability to simultaneously 3D print dielectric polymer and conductive nano-particle silver ink with Nano Dimension’s DragonFly™ Pro System, not only is production time kept low, but conductive traces can now be printed within the insulating materials, instead of being on the surfaces of the structures. This affords designers much greater freedom to experiment with new forms, while taking the advantages of using MIDs one step further in terms of adding functionality, reducing weight, streamlining product structure and improving reliability.

Furthermore, with the ability to rapidly prototype MIDs in-house and in an IP-safe environment, the risk, time and cost penalties of outsourcing production are no longer concerns designers need to worry about.

embedded-electronics-applications-button

Embedded Electronics3D Printed Embedded Electronics Improves Device Performance

3D printed electronics opens the door to a world of new component embedding capabilities. With the ability to embed signal traces and both active and passive components inside 3D parts, designers can produce prototypes with embedded sensors, antennas, complex geometries for simultaneous functionality validation.

Learn More

non-planer-electro-magnet-3d-printing

ElectromagnetsRapid Prototyping of Electromagnets with 3D Printing

The DragonFly™ Pro System makes it possible to 3D print electromagnetic coils, enabling product designers to vary physical shape and size for optimized application fit.

Learn More

3d-printed-molded-interconnected-devices-mids

Molded Interconnected Devices (MIDs)New Capabilities with 3D Printed MIDs

With the ability to simultaneously 3D print dielectric polymer and conductive nano-particle silver ink with Nano Dimension’s DragonFly Pro System, conductive traces can now be printed within the insulating materials of Molded Interconnect Devices.

Learn More