DragonFly LDM

Lights-Out Digital Manufacturing system for Printed Electronics

DragonFly™ LDM 3D Printer

The DragonFly LDM™ Lights-Out Digital Manufacturing system is the industry's only comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuitry. This precision additive manufacturing platform uniquely integrates an extremely precise inkjet deposition printer with dedicated nano-inks and optimized 3D software to print electronic circuits such as Printed Circuit Boards (PCBs), antennas, capacitors and sensors. Incorporating proprietary, state-of-the-art Lights-out Digital Manufacturing (LDM) technology, the DragonFly™ requires little or no operator intervention.

With the DragonFly LDM™ designers can move rapidly from concept and design validation to production of precision electronic components, while keeping the entire process securely in-house. Companies can now reduce demand on prototyping and short-run manufacturing resources and lower the total cost of operation in comparison to traditional manufacturing methods. The DragonFly LDM™ is designed for industry 4.0 and manufacturing for the Internet of Things, and is the extension of the award-winning DragonFly Pro precision system.

Key Features:

  • Long uninterrupted printed for increased uptime and improved yield
  • Supports 3D printed multilayer printed circuit boards (PCBs), capacitors, coils, sensors, antennas and more
  • Simpler and faster operation for minimal maintenance Switch
  • New automatic printhead self-cleaning system
  • Offered also as an upgrade for existing DragonFly Pro users

DragonFly LDM Resources

Sample 3D Printed Parts

Size and Weight

1400mm x 800mm x 1800mm
520Kg, (1150 lbs)

Build Size

160mm x 160mm x 3mm (6.3″ x 6.3″ x 1/8″)
Model weight on tray: 135 kg

Layer Thickness

Trace Layer: 17 micron
Dielectric Layer: 35 micron

DragonFly LDM 3D Printer

Mechanical Accuracy

1 Micron (0.001 mm)

Software

Proprietary DragonFly and SWITCH Software

Full Technical Specifications Below

Download DragonFly LDM Brochure

Imagine These Scenarios:

  • Innovating freely without traditional manufacturing process constraints.
  • Printing individual sections of a circuit design for on-the-fly testing.
  • Creating vias and through holes with no drilling or plating required.
  • Printing electronic circuitry in-house in just hours.
  • Innovating while saving space, weight and cost with designs incorporating complex geometries and new functions.
  • Streamlined workflows and easy operation
  • Long uninterrupted 3D printing runs with minimal supervision for increased uptime.

Virtually Limitless Design Flexibility

By synthesizing precision and accuracy with multi-material additive manufacturing, the DragonFly LDM™ unlocks a whole new world of design possibilities for printed electronics. A wide array of PCB features, such as vias and through-holes, can be fully 3D printed in-house without subsequent etching, drilling and plating. A range of non-planar electronic components, such as Molded Interconnect Devices (MIDs) and electromagnets, also can be printed and tested on-the-fly.

The DragonFly LDM™ is transforming how product development teams work – waiting days or weeks for a custom prototype to be fabricated offsite can finally be a thing of the past. The freedom to innovate empowers progress, encourages product advancement, lowers development risks and enables faster time-to-market. Ultimately, it creates a better end-product.

Multi-Material Additive Manufacturing: Metals and Polymers in One Print Job

Simultaneous multi-material additive manufacturing is a revolutionary approach that helps redefine the electronics of tomorrow for attributes including density, size and flexibility.

The DragonFly LDM™ is fitted with two printheads, one for nano-Silver conductive ink and the other for dielectric polymer ink. This set-up allows the DragonFly LDM™ to concurrently print with both advanced inks in a single print job.

DragonFly LDM inkjet deposition system is setting new precision standards for 3D printed electronics., making it ideal for industries with the most demanding design and quality requirements, such as aerospace, automotive, telecommunications, healthcare and more.

 

Deposition Technology Piezo drop on demand inkjet
Number of Printheads 2, one for each Ink
Minimum Trace Layer Thickness 17 micron
Minimum Dielectric Layer Thickness 35 micron
Inks Nano Dimension Optimized Silver nano particles and dielectric inks
Trace Conductivity Relative to Copper 5 process dependent
Dielectric Constant** From 2.9 @ 200MHz to 2.69 at 2GHz
Build Volume 160mm x 160mm x 3mm
Mechanical Accuracy 0.001mm (1 micron)
Software Proprietary DragonFly and SWITCH
Extrernal File Compatibility Gerber, ODB++
Operating System Windows
Network Connectivity Ethernet TCP/IP 10/100/1000
Availability > 85%
Dimensions 1400mm x 800mm x 1800mm
Weight 520Kg, (1150 lbs)
Power Supply*** 230VAC, 20A, 50-60Hz
Operational Temperature 64°F (18°C) to 72°F (22 °C)
Operational Humidity 35 non-condensing
Regulatory Compliance UL, CE, FCC

AgCite™ Nanoparticle Silver Ink

AgCite™ nano-Silver ink can be optimized for a wide range of applications such as RFID and OLED components while maintaining excellent conductivity, adhesion and flexibility. Furthermore. unlike regular metal powders that require high sintering temperatures, AgCite™ nano-Silver inks can achieve a sintering temperature low enough to support a broad range of substrates such as paper, polymer, glass and Indium Tin Oxide (ITO), making the inks suitable for a variety of uses.

Dielectric Nanoparticle Polymer Ink

Photopolymer dielectric inks are UV cured as part of the DragonFly™ Pro print process. During printing, ultraviolet light exposure is algorithmically controlled to ensure optimal material properties. These inks are highly compatible with Nano Dimension’s conductive AgCite™ family of nano-Silver inks for simultaneous inkjet printing on the DragonFly™ Pro platform and can also be printed on a range of substrate surfaces, including glass.