Conductive & Insulating Ink 3D Printing Material

In-House Development of Award-Winning Nanoparticle Inks

Nano Dimension is a global pioneer in bringing nanoparticle multi-material additive manufacturing to electronics. It empowers designers and engineers to print polymers and metals simultaneously to create functional electronic components. Optimizing nanoparticle inks to various applications requires fine control over the ink formulation and production processes. At Nano Dimension, the award-winning AgCite™ and dielectric inks used by the flagship DragonFly™ Pro platform are developed in-house, in a dedicated nano-ink facility. The inks have unique and compatible sintering and curing properties, tightly controlled particle sizes, as well as excellent stability for precision additive manufacturing tasks.

The unique pairing of a dielectric ink optimized for mechanical support, thermal resistance and electrical insulation with a highly conductive nano-Silver ink that sinters at low temperatures is solving key challenges in the electronics world.

With the DragonFly™ Pro platform’s ability to utilize both inks concurrently in a print job, alongside its high print resolution and pinpoint precision, the system enables virtually limitless design flexibility in a wide array of applications and industries.

Read about our AgCite™ nano-Silver ink and dielectric polymer ink as well as their industrial applications below.

AgCite™ Nanoparticle Silver Ink

Nano Dimension’s AgCite™ family of nanoparticle Silver inks offers multiple groundbreaking advantages over traditional materials.

Years of R&D have enabled us to reliably extract pure Silver particles of 10 to 100 nanometers in size, while controlling for other characteristics such as shape and particle dispersion.

This ensures that each batch of customized AgCite™ nano-Silver ink can be optimized for a wide range of applications such as RFID and OLED components, while maintaining excellent conductivity, adhesion and flexibility. Furthermore. unlike regular metal powders that require high sintering temperatures, AgCite™ nano-Silver inks can achieve a sintering temperature low enough to support a broad range of substrates such as paper, polymer, glass and Indium Tin Oxide (ITO), making the inks suitable for a variety of uses.

Oxidation-resistant Copper Nanoparticles

Nano Dimension has developed novel Copper nanoparticles that are resistant to oxidation and can fuse into conductive lines even with sintering at below 160°C.

These innovative Copper nanoparticles are used to develop advanced conductive ink that can significantly reduce the cost of raw materials used in precision 3D printing of electronics and printed circuit boards (PCBs).

Dielectric Nanoparticle Polymer Ink

Our suite of dielectric polymer inks are designed to complement the conductive AgCite™ nano-Silver ink and provide essential electrical insulation even when printed down to hundred-micron widths.

To ensure reliability and optimization for multilayer PCB printing, we have engineered specific properties in interference, adhesion, thermal dissipation and flammability into the ink formula used.

The photopolymer dielectric inks are UV cured as part of the DragonFly™ Pro print process. During printing ultraviolet light exposure is algorithmically controlled to ensure optimal material properties. These inks are highly compatible with Nano Dimension’s conductive AgCite™ family of nano-Silver inks for simultaneous inkjet printing on the DragonFly™ Pro platform and can also be printed on a range of substrate surfaces, including glass.

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